The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Jul. 02, 2020
Applicants:

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Leilei Cheng, Beijing, CN;

Bin Zhou, Beijing, CN;

Jun Liu, Beijing, CN;

Luke Ding, Beijing, CN;

Qinghe Wang, Beijing, CN;

Yongchao Huang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1333 (2006.01); G02F 1/1362 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1248 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); H01L 27/1288 (2013.01); H01L 27/3248 (2013.01);
Abstract

An array substrate includes an insulation layer and one or more stepped holes each penetrating through the insulation layer in a direction perpendicular to the insulation layer. Each stepped hole includes a first hole and a second hole under the first hole, a radius of the first hole at a bottom is a first radius, a radius of the second hole at a top is a second radius which is substantially smaller than the first radius, and a difference between the first radius and the second radius is 0.2 μm to 0.6 μm.


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