The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Mar. 02, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Peng Gu, Santa Barbara, CA (US);
Krishna Malladi, San Jose, CA (US);
Hongzhong Zheng, Los Gatos, CA (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 31/12 (2006.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01); H01L 25/18 (2006.01); H04B 10/80 (2013.01); H04Q 11/00 (2006.01); G02F 1/01 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); G02F 1/011 (2013.01); H01L 25/18 (2013.01); H01L 31/02002 (2013.01); H01L 31/02327 (2013.01); H01L 31/12 (2013.01); H04B 10/801 (2013.01); H04Q 11/0071 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06541 (2013.01); H04Q 2011/0073 (2013.01); H04Q 2011/0081 (2013.01);
Abstract
According to one general aspect, an apparatus may include a memory circuit die configured to store a lookup table that converts first data to second data. The apparatus may also include a logic circuit die comprising combinatorial logic circuits configured to receive the second data. The apparatus may further include an optical via coupled between the memory circuit die and the logical circuit die and configured to transfer second data between the memory circuit die and the logic circuit die.