The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Nov. 30, 2020
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Ashish Baraskar, Santa Clara, CA (US);

Raghuveer S. Makala, Campbell, CA (US);

Peter Rabkin, Cupertino, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 27/11556 (2017.01); H01L 27/11519 (2017.01); H01L 27/11582 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/6835 (2013.01); H01L 21/76254 (2013.01); H01L 24/08 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/11519 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01); H01L 27/11582 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80006 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01);
Abstract

A semiconductor structure includes a memory die bonded to a support die. The memory die includes an alternating stack of insulating layers and electrically conductive layers located over a first single crystalline semiconductor layer, and memory stack structures extending through the alternating stack and containing respective memory film and a respective vertical semiconductor channel including a single crystalline channel semiconductor material. The support die includes a peripheral circuitry. Substrates employed to provide the memory die and the support die can be reused by replacing one of the substrates with an alternative low-cost substrate that provides structural support to the bonded assembly.


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