The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Feb. 26, 2021
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Ryoichi Kato, Kawasaki, JP;

Yuma Murata, Kawasaki, JP;

Naoyuki Kanai, Kawasaki, JP;

Akito Nakagome, Kawasaki, JP;

Yoshinari Ikeda, Kawasaki, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/49844 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/48153 (2013.01);
Abstract

A semiconductor module includes first to fourth semiconductor elements, each having an upper-surface electrode and a lower-surface electrode, first to fourth conductive layers, each extending in a first direction and being independently disposed side by side in a second direction orthogonal to the first direction, and an output terminal connected to the second and third conductive layers. The lower-surface electrodes of each of the first to fourth semiconductor elements are respectively conductively connected to the first to fourth conductive layers. The third conductive layer and the fourth conductive layer are disposed between the first conductive layer and the second conductive layer and are connected to the output terminal to have an equal potential.


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