The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Oct. 15, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Akihiro Fujii, Kyoto, JP;
Yuta Morimoto, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
The present disclosure enables a component to operate stably by making it unlikely that the component will be affected by unwanted electromagnetic waves generated by another component. A module includes: a substrate; a first component and a second component that are mounted on one main surface of the substrate; a sealing resin layer that seals the first component and the second component; and a shield layer that covers part of the sealing resin layer. A recess is formed in the sealing resin layer toward the one main surface from a surface including an upper surface of the sealing resin layer between the first component and the second component in a plan view from a direction perpendicular to the one main surface. The shield layer is not provided in the recess of the sealing resin layer.