The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Mar. 26, 2019
Siemens Aktiengesellschaft, Munich, DE;
Ewgenij Ochs, Fürth, DE;
Stefan Pfefferlein, Heroldsberg, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A semiconductor assembly includes a carrier element with a first carrier element conductor path, a semiconductor chip, an electrically insulating element having a first insulating element conductor path, and a first spacer element. The semiconductor chip is connected electrically and mechanically on a first semiconductor side via a first connecting material to the first carrier element conductor path. The semiconductor chip is connected on a second semiconductor side, which faces away from the first semiconductor side of the semiconductor chip, via a second connecting material to the first insulating element conductor path, which is arranged on a first insulating element side of the electrically insulating element. The first spacer element is arranged for maintaining a distance between the carrier element and an assembly element facing toward the second semiconductor side of the semiconductor chip and is connected mechanically to both the carrier element and the assembly element.