The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Mar. 03, 2020
Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

António José Marques Trindade, Cork, IE;

Raja Fazan Gul, Cork, IE;

Ronald S. Cok, Rochester, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/50 (2006.01); B81C 1/00 (2006.01); C23C 16/455 (2006.01); H03H 3/08 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B81C 1/00269 (2013.01); H01L 21/50 (2013.01); C23C 16/45525 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H03H 3/08 (2013.01); H03H 9/64 (2013.01);
Abstract

A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.


Find Patent Forward Citations

Loading…