The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Oct. 25, 2018
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 27/22 (2006.01); H01F 27/32 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 27/22 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 2017/048 (2013.01);
Abstract
An electronic component comprising a main body part including an insulating layer and a conductor layer laminated alternately. The insulating layer and the conductor layer are partially exposed on a side surface of the main body part in a direction orthogonal to a lamination direction. Also, the side surface of the main body part is provided with a metal film extending in the lamination direction to cover the insulating layer and the conductor layer exposed on the side surface.