The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Jun. 08, 2020
Applicants:

Inventec (Pudong) Technology Corporation, Shanghai, CN;

Inventec Corporation, Taipei, TW;

Inventors:

Jyun-Ji Lu, Taipei, TW;

Sheng-Chieh Hsu, Taipei, TW;

Chih-Kai Yang, Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); F28D 15/04 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); F28D 15/04 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20336 (2013.01); G06F 2200/201 (2013.01);
Abstract

A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.


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