The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

Sep. 17, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Akito Sasaki, Kariya, JP;

Ryosuke Sakai, Kariya, JP;

Hiroaki Miwa, Kariya, JP;

Takeshi Tsukamoto, Kariya, JP;

Hiroshi Nomura, Kariya, JP;

Takuma Esaka, Kariya, JP;

Tatsuaki Sugito, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/20 (2006.01); G01R 19/00 (2006.01);
U.S. Cl.
CPC ...
G01R 15/205 (2013.01); G01R 15/207 (2013.01); G01R 19/0092 (2013.01);
Abstract

A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.


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