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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11396597 B1

PDFFull Text
Date of Patent:
Jul. 26, 2022

Filed:

Oct. 24, 2018

Epoxy resin composition and cured object obtained therefrom

Applicant:

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Inventor:

Koichi Hattori, Tokyo, JP;

Assignee:

NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08L 63/04 (2006.01); C08F 20/14 (2006.01); C08F 220/18 (2006.01); C08F 236/06 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/40 (2006.01); C08L 53/00 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); C08F 20/14 (2013.01); C08F 220/1804 (2020.02); C08F 220/1808 (2020.02); C08F 236/06 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/26 (2013.01); C08G 59/4021 (2013.01); C08L 53/00 (2013.01); C08G 2170/00 (2013.01); C08L 2201/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/30 (2013.01); C08L 2205/03 (2013.01);
Abstract

Provided are an epoxy resin composition and a film or a molding material. The epoxy resin composition is an epoxy resin composition including the following components A to D: component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; component B: an epoxy resin that is liquid at 30° C.; component C: a diblock copolymer having a B-M structure (where M represents a block formed of a homopolymer of methyl methacrylate or a copolymer containing at least 50 wt % of methyl methacrylate, B represents a block that is incompatible with the epoxy resins and the block M, and that has a glass transition temperature Tg of 20° C. or less, and respective blocks represented by B and M are directly bonded to each other or are linked to each other through a linking group); and component D: an amine-based curing agent that is dicyandiamide or a derivative thereof.

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