The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Sep. 05, 2020
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Chun-Yang Hung, Taoyuan, TW;

Li-Kuang Tan, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 3/02 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); B22D 19/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); B22D 19/0063 (2013.01); F28F 3/02 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H05K 7/20509 (2013.01); F28F 2275/14 (2013.01);
Abstract

In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.


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