The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Apr. 08, 2020
Nano Dimension Technologies Ltd., Nes Ziona, IL;
Daniel Sokol, Rishon l'etsion, IL;
Aviram Lancovici, Rehovot, IL;
Nano Dimension Technologies, LTD., Nes Ziona, IL;
Abstract
The disclosure relates to systems and methods for using additive manufacturing techniques for fabricating ball grid array (BGA) surface mounting pads (SMP), and surface mounted technology devices (SMT) package sockets. More specifically, the disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA SMP, and or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.