The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Aug. 28, 2020
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Scott D. Morrison, Austin, TX (US);
Karthik Shanmugam, Singapore, SG;
Raymundo M. Camenforte, San Jose, CA (US);
Rakshit Agrawal, Milpitas, CA (US);
Flynn P. Carson, Redwood City, CA (US);
Kiranjit Dhaliwal, Santa Clara, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/94 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17164 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01);
Abstract
Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.