The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Aug. 27, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Seiichirou Itou, Kyoto, JP;

Yuichiro Ishizaki, Kyoto, JP;

Genshitaro Kawamura, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/05 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/495 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/49531 (2013.01); H05K 1/09 (2013.01); H05K 1/16 (2013.01); H05K 2201/0317 (2013.01);
Abstract

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.


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