The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
May. 07, 2018
The Boeing Company, Chicago, IL (US);
Jesse A. Laplante, Monroe, WA (US);
Robert T. Johnson, Everett, WA (US);
Jin-Seog Seo, Mukilteo, WA (US);
Jacky-Vy C. Chau, Seattle, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
A method of forming a wire bundle, the method includes removably coupling a plurality of wire bundle mounting structures to a wire bundle form board, the plurality of wire bundles mounting structures being coupled to the wire bundle form board in a predetermined pattern corresponding to a configuration of the wire bundle. The method also includes inserting one or more wires, of the wire bundle, into the plurality of wire bundle mounting structures, coupling the one or more wires to the plurality of wire bundle mounting structures with a respective wire bundle retention strap of each of the plurality of wire bundle mounting structures so as to form the wire bundle, and removing the one or more wires and the plurality of wire bundle mounting structures from the wire bundle form board as a singular unit.