The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Apr. 07, 2020
Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventor:

Cheng-Hsien Lee, Taoyuan, TW;

Assignee:

QUANTA COMPUTER INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/05 (2006.01); H01R 13/03 (2006.01); H01R 12/71 (2011.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 13/05 (2013.01); H01R 12/714 (2013.01); H01R 12/737 (2013.01); H01R 13/03 (2013.01); H01R 13/035 (2013.01); H01R 2201/06 (2013.01);
Abstract

A connection pin for an expansion socket can be treated to improve signal (e.g., reduce noise) for high speed applications. A connection pin can be treated to have a conductive plating covering a proximal region of the connection pin. Electrical signals between an expansion card in contact with the connection pin and the circuit board to which the connection pin is coupled can pass directly through the conductive plating of the proximal region. However, the distal region of the connection pin can be treated to be devoid of the conductive plating, such as by being covered with a high dielectric loss and/or high-resistance material or through removal of the conductive plating in that region. Thus, electrical signals passing through the connection pin will tend to pass through the conductive plating rather than along the distal region of the pin. Thus, signal reflections and other artifacts and noise can be avoided.


Find Patent Forward Citations

Quick Actions:

Lee, Cheng-Hsien. (2022). Treated connection pins for high speed expansion sockets (U.S. Patent No. 11394146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11394146

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