The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Nov. 14, 2019
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Yoshimitsu Oda, Osaka, JP;

Ryoji Inoue, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); B23K 20/227 (2006.01); B32B 15/01 (2006.01); C25D 3/38 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); B23K 103/22 (2006.01); B23K 20/04 (2006.01); C22C 38/40 (2006.01); H01M 10/0525 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/667 (2013.01); B23K 20/227 (2013.01); B32B 15/015 (2013.01); C25D 3/38 (2013.01); C25D 5/50 (2013.01); C25D 7/0621 (2013.01); H01M 4/661 (2013.01); H01M 4/669 (2013.01); B23K 20/04 (2013.01); B23K 2103/22 (2018.08); C22C 38/40 (2013.01); H01M 10/0525 (2013.01); H01M 2004/027 (2013.01);
Abstract

This foil for a secondary battery negative electrode collector (negative electrode-collecting foil) includes a first Cu layer () made of Cu or a Cu-based alloy, a stainless steel layer (), and a second Cu layer () made of Cu or a Cu-based alloy, which are disposed in this order, a total thickness is 200 μm or less, and 0.01% proof stress is 500 MPa or more.


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