The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Dec. 23, 2020
Applicant:

Hangzhou Hangke Optoelectronics Co., Ltd., Hangzhou, CN;

Inventors:

Qianjun Yan, Hangzhou, CN;

Zhaozhang Zheng, Hangzhou, CN;

Lingli Ma, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 23/538 (2006.01); F21K 9/237 (2016.01); F21K 9/232 (2016.01); F21Y 107/50 (2016.01); F21V 29/50 (2015.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21K 9/232 (2016.08); F21K 9/237 (2016.08); H01L 23/5387 (2013.01); H01L 25/0753 (2013.01); H01L 33/502 (2013.01); F21V 29/50 (2015.01); F21Y 2107/50 (2016.08); H01L 2933/0066 (2013.01);
Abstract

An omnidirectional LED light wire and a packaging method thereof, a light source and a lamp, and in particular, to the technical field of LED lighting. The omnidirectional LED light wire includes one or more than one flip chip and two or more than two conductive components. The one or more than one flip chip is connected through the conductive components to realize an electrical connection relationship, in single, in series, parallel or a combination of series and parallel, of the one or more than one flip chip. In view of technical problems of low efficacy, low temperature resistance and poor heat dissipation of the existing FPC substrate, the disclosure breaks bottlenecks of temperature resistance and dissipation of the FPC substrate.


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