The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jun. 23, 2020
Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;
Mingzhu Wang, Yuyao, CN;
Nan Guo, Yuyao, CN;
Zhenyu Chen, Yuyao, CN;
Bojie Zhao, Yuyao, CN;
Takehiko Tanaka, Yuyao, CN;
Feifan Chen, Yuyao, CN;
Ye Wu, Yuyao, CN;
NINGBO SUNNY OPOTECH CO., LTD., Yuyao, CN;
Abstract
A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.