The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Apr. 16, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seunghun Shin, Suwon-si, KR;

Jaejune Jang, Suwon-si, KR;

Dukseo Park, Gyeonggi-do, KP;

Sunwoo Park, Suwon-si, KR;

Howoo Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/64 (2006.01); H01G 4/40 (2006.01); H01G 4/005 (2006.01); H01L 21/768 (2006.01); H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01L 25/065 (2006.01); H01G 4/236 (2006.01); H01G 4/012 (2006.01); H01G 4/35 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01G 4/005 (2013.01); H01G 4/012 (2013.01); H01G 4/236 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 21/76885 (2013.01); H01L 21/76897 (2013.01); H01L 23/642 (2013.01); H01L 25/065 (2013.01); H01L 28/75 (2013.01); H01L 28/91 (2013.01); H01G 4/35 (2013.01); H01L 24/19 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01);
Abstract

A decoupling capacitor includes a first insulating layer extending in a horizontal direction, a storage plate arranged on the first insulating layer, a top plate facing the storage plate, a second insulating layer interposed between the storage plate and the top plate and having a plurality of through holes, a capacitor block including a plurality of capacitor structures in the plurality of through holes, a wiring structure covering the top plate, a first conductive pad arranged on the wiring structure and configured to be electrically connected to the storage plate through a first conductive path of the wiring structure, and a second conductive pad spaced apart from the first conductive pad in the horizontal direction in the same plane as the first conductive pad and configured to be electrically connected to the top plate through a second conductive path of the wiring structure.


Find Patent Forward Citations

Loading…