The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Aug. 31, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution layer, a semiconductor chip disposed on the redistribution layer and an expanded layer surrounding the semiconductor chip, connection terminals on the expanded layer, and a wiring structure electrically connecting the redistribution layer to the connection terminals. Each of the connection terminal includes a seed layer, a terminal base layer including a terminal groove exposing a part of an upper surface of the seed layer on the seed layer and formed of a first metal, a terminal cover layer including a barrier portion filling the terminal groove and a cover base portion covering the barrier portion and the terminal base layer and formed of a second metal, and a terminal protective layer covering the terminal cover layer and formed of a third metal.