The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Dec. 21, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Kazutoshi Tsuyutani, Tokyo, JP;
Yoshihiro Suzuki, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5383 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01);
Abstract
Disclosed herein is a circuit board that includes first and second conductor layers, an insulating layer positioned between the first and second conductor layers, and a via conductor formed inside a via penetrating the insulating layer and connecting the first and second conductor layers. The via has a shape in which a diameter thereof is reduced in a depth direction. The via has a first section positioned on the first conductor layer side and a second section positioned on the second conductor layer side. A reduction in the diameter per unit depth in the first section is greater than that in the second section.