The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
May. 18, 2018
Applicant:
Sony Interactive Entertainment Inc., Tokyo, JP;
Inventors:
Kazuyuki Shikama, Tokyo, JP;
Morio Usami, Tokyo, JP;
Assignee:
Sony Interactive Entertainment Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H05K 1/0206 (2013.01); H05K 7/205 (2013.01);
Abstract
A heatsink () is disposed on a lower surface of a circuit board (). The circuit board () has through holes (h) that penetrate the circuit board () in an area (A) where an integrated circuit apparatus () is disposed. Heat conduction paths () are provided in the through holes (h). The heat conduction paths () connect the integrated circuit apparatusand the heatsink (). This structure allows for disposition of a component different from the heatsink () on the same side as the integrated circuit apparatus (), thus ensuring a higher degree of freedom in a component layout.