The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Mar. 05, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Esmaeil Faramarzi, Richardson, TX (US);

Madhukar Budagavi, Plano, TX (US);

Rajan Laxman Joshi, San Diego, CA (US);

Hossein Najaf-Zadeh, Allen, TX (US);

Indranil Sinharoy, Richardson, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 9/00 (2006.01); G06T 7/33 (2017.01);
U.S. Cl.
CPC ...
G06T 9/001 (2013.01); G06T 7/344 (2017.01); G06T 2207/10028 (2013.01);
Abstract

An encoding device, a decoding device, and a method for mesh decoding are disclosed. The method for mesh decoding includes receiving a compressed bitstream. The method also includes separating, from the compressed bitstream, a first bitstream and a second bitstream. The method further includes decoding, from the second bitstream, connectivity information of a three dimensional (3D) mesh. The method additionally includes decoding, from the first bitstream, a first frame and a second frame that include patches. The patches included in the first frame represent vertex coordinates of the 3D mesh and the patches included in the second frame represent a vertex attribute of the 3D mesh. The method also includes reconstructing a point cloud based on the first and second frames. Additionally, the method also includes applying the connectivity information to the point cloud to reconstruct the 3D mesh.


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