The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Mar. 08, 2021
Applicant:

University of Louisiana AT Lafayette, Lafayette, LA (US);

Inventors:

Siroos Madani, Lafayette, LA (US);

Mohammad R. Madani, Lafayette, LA (US);

Magdy Bayoumi, Lafayette, LA (US);

Assignee:

University of Louisiana Lafayette, Lafayette, LA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/394 (2020.01); H01L 23/00 (2006.01); G06F 30/392 (2020.01); G06F 21/75 (2013.01); H01L 25/065 (2006.01); G06F 30/39 (2020.01);
U.S. Cl.
CPC ...
G06F 30/394 (2020.01); G06F 21/75 (2013.01); G06F 30/392 (2020.01); H01L 23/57 (2013.01); H01L 23/573 (2013.01); H01L 25/0657 (2013.01); G06F 30/39 (2020.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01);
Abstract

The method for creating integrated circuits (IC) protects the design of a manufactured IC from being copied or counterfeited. This method protects the design of an IC chip from deliberate copying and counterfeiting by reverse engineering to gain access to the critical points in the IC chip and to siphon its functions and design. The method makes the copying, counterfeiting, and controlling by addition of Trojan circuits during manufacturing almost impossible task. It also allows chip designers to outsource the final bonding of the tiers without any fears that their design may get compromised.


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