The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jan. 08, 2021
Applicants:
Shuwei Sun, Framingham, MA (US);
Francois-charles Dary, Newton, MA (US);
Marc Abouaf, Harvard, MA (US);
Patrick Hogan, Somerville, MA (US);
Qi Zhang, Wellesley, MA (US);
Inventors:
Shuwei Sun, Framingham, MA (US);
Francois-Charles Dary, Newton, MA (US);
Marc Abouaf, Harvard, MA (US);
Patrick Hogan, Somerville, MA (US);
Qi Zhang, Wellesley, MA (US);
Assignee:
MATERION NEWTON INC., Newton, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/02 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); H01B 1/02 (2006.01); B81C 1/00 (2006.01); C22F 1/04 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01); C22F 1/14 (2006.01); C21D 1/00 (2006.01); C21D 9/00 (2006.01); H01L 27/12 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 23/532 (2006.01); B32B 17/06 (2006.01); B32B 15/04 (2006.01); B32B 15/01 (2006.01); B32B 15/20 (2006.01); B32B 15/02 (2006.01); B32B 15/18 (2006.01); C03C 17/40 (2006.01); C03C 17/36 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0446 (2019.05); B32B 15/01 (2013.01); B32B 15/017 (2013.01); B32B 15/018 (2013.01); B32B 15/02 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 17/061 (2013.01); B81C 1/00 (2013.01); B81C 1/00031 (2013.01); B81C 1/00404 (2013.01); B81C 1/00523 (2013.01); B81C 1/00547 (2013.01); C03C 17/36 (2013.01); C03C 17/3639 (2013.01); C03C 17/3642 (2013.01); C03C 17/3655 (2013.01); C03C 17/3668 (2013.01); C03C 17/3671 (2013.01); C03C 17/40 (2013.01); C21D 1/00 (2013.01); C21D 9/00 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/08 (2013.01); C22F 1/14 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/32 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); G06F 3/0443 (2019.05); H01B 1/026 (2013.01); H01L 23/53238 (2013.01); H01L 27/1244 (2013.01); H01L 29/4908 (2013.01); H01L 29/6675 (2013.01); H01L 29/78603 (2013.01); H01L 29/78666 (2013.01); C21D 2201/00 (2013.01); C21D 2211/00 (2013.01); C21D 2251/00 (2013.01); G06F 2203/04103 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/1266 (2015.01); Y10T 428/1275 (2015.01); Y10T 428/1284 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12681 (2015.01); Y10T 428/12687 (2015.01); Y10T 428/12694 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12743 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12812 (2015.01); Y10T 428/12819 (2015.01); Y10T 428/12826 (2015.01); Y10T 428/12847 (2015.01); Y10T 428/12861 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12931 (2015.01);
Abstract
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.