The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Sep. 11, 2020
Applicant:

Flir Detection, Inc., Stillwater, OK (US);

Inventors:

Hartmut Brands, Oak Ridge, TN (US);

Stephen W. Fleetwood, Knoxville, TN (US);

Leslie D. Hoy, Knoxville, TN (US);

Jason K. Smith, Oak Ridge, TN (US);

Felix J. Liang, Oak Ridge, TN (US);

Matthew D. Waggoner, Knoxville, TN (US);

Kyle Hawes, Knoxville, TN (US);

Jeffrey Robert Preston, Knoxville, TN (US);

Jeffrey A. Verity, Knoxville, TN (US);

Assignee:

Teledyne FLIR Detection, Inc., Stillwater, OK (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01T 1/16 (2006.01); G01T 1/17 (2006.01); G01T 1/02 (2006.01); G04B 37/08 (2006.01); H01L 27/146 (2006.01); G01T 1/36 (2006.01); G01T 3/06 (2006.01); G01T 3/08 (2006.01); G01T 1/175 (2006.01); G01T 1/18 (2006.01); G01T 1/202 (2006.01); G01T 1/205 (2006.01); G01T 1/208 (2006.01); G01T 1/24 (2006.01);
U.S. Cl.
CPC ...
G01T 1/1603 (2013.01); G01T 1/02 (2013.01); G01T 1/023 (2013.01); G01T 1/026 (2013.01); G01T 1/171 (2013.01); G01T 1/175 (2013.01); G01T 1/18 (2013.01); G01T 1/205 (2013.01); G01T 1/208 (2013.01); G01T 1/2023 (2013.01); G01T 1/247 (2013.01); G01T 1/248 (2013.01); G01T 1/366 (2013.01); G01T 3/065 (2013.01); G01T 3/085 (2013.01); G04B 37/08 (2013.01); H01L 27/14658 (2013.01);
Abstract

Techniques are disclosed for systems and methods to provide a radiation detector module for a radiation detector. A radiation detector module includes a metallic and/or metalized enclosure, a radiation sensor disposed within the enclosure, readout electronics configured to provide radiation detection event signals corresponding to incident ionizing radiation in the radiation sensor, and a cap including an internal interface configured to couple to the readout electronics and an external interface configured to couple to a radiation detector, where the cap is configured to hermetically seal the radiation sensor within the enclosure. The cap may be implemented as an edge plated printed circuit board (PCB) including a slot configured to mate with a planar edge of an open surface of the enclosure, where the slot is soldered to the planar edge of the enclosure to hermetically seal the radiation sensor within the enclosure.


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