The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Feb. 06, 2018
Hitachi High-tech Corporation, Tokyo, JP;
Ryo Hirano, Tokyo, JP;
Takayuki Mizuno, Tokyo, JP;
Tomohisa Ohtaki, Tokyo, JP;
Toru Fujimura, Tokyo, JP;
Shigehiko Kato, Tokyo, JP;
Yasuhiko Nara, Tokyo, JP;
Katsuo Ohki, Tokyo, JP;
Akira Kageyama, Tokyo, JP;
Masaaki Komori, Tokyo, JP;
Hitachi High-Tech Corporation, Tokyo, JP;
Abstract
As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.