The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jan. 15, 2019
Applicant:
Tokuyama Corporation, Yamaguchi, JP;
Inventors:
Takafumi Shimoda, Yamaguchi, JP;
Takayuki Negishi, Yamaguchi, JP;
Yuki Kikkawa, Yamaguchi, JP;
Seiji Tono, Yamaguchi, JP;
Assignee:
TOKUYAMA CORPORATION, Yamaguchi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/395 (2006.01); C11D 7/32 (2006.01); C11D 7/50 (2006.01); C11D 11/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 7/3209 (2013.01); C11D 7/5004 (2013.01); C11D 11/0047 (2013.01); H01L 21/0209 (2013.01); H01L 21/02087 (2013.01);
Abstract
A treatment liquid for cleaning a semiconductor wafer is a treatment liquid contains (A) a hypochlorite ion and (C) a solvent, in which pH at 25° C. is more than 7 and less than 12.0. A method for removing ruthenium and tungsten from a semiconductor wafer and cleaning the semiconductor wafer includes bringing the treatment liquid into contact with the semiconductor wafer containing ruthenium or tungsten is provided.