The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Mar. 21, 2018
Applicant:
Microcraft Korea Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/38 (2014.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); B41M 5/00 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09D 11/38 (2013.01); B41M 5/0023 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); H05K 1/0326 (2013.01); H05K 3/287 (2013.01);
Abstract
The present invention relates to a resin composition for inkjet printing used to form a resin layer serving as an insulation layer of a printed wiring board by an inkjet printing method.
Hidehira, Yorio. (2022). Resin composition for inkjet printing and printed wiring board prepared by using same (U.S. Patent No. 11390766). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11390766
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile