The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jul. 25, 2018
Toray Industries, Inc., Tokyo, JP;
Kazunori Hondo, Nagoya, JP;
Norikazu Ishikawa, Nagoya, JP;
Masanori Hirano, Nagoya, JP;
Nobuyuki Tomioko, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A sheet molding compound includes an epoxy resin composition meeting (I) and/or (II): (I) a component has a hydroxy group equivalent weight of 20 to 120, and (II) carbon fibers are bundle-shaped aggregates of discontinuous carbon fibers such that in a plane that has a largest width perpendicular to an alignment direction of the carbon fibers, two acute angles, referred to as angle a and angle b, formed between the alignment direction of the carbon fibers and sides formed by arrays of both ends of the carbon fibers in the bundle-shaped aggregates are 2° or more and 30° or less, the epoxy resin composition has a viscosity at 30° C. of 3.0×104 Pa·s or more and 1.0×106 Pa·s or less, and the epoxy resin composition has a viscosity at 120° C. of 1.0×102 Pa·s or more and 5.0×103 Pa·s or less.