The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Nov. 23, 2018
Applicant:
Tokai Carbon Korea Co., Ltd, Gyeonggi-do, KR;
Inventor:
Chang Wook Seol, Gyeonggi-do, KR;
Assignee:
TOKAI CARBON KOREA CO., LTD, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); B32B 18/00 (2006.01); B32B 38/00 (2006.01); H01L 21/683 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
C04B 37/001 (2013.01); B32B 18/00 (2013.01); B32B 38/0012 (2013.01); H01L 21/6838 (2013.01); B32B 2037/0092 (2013.01); B32B 2457/14 (2013.01); B32B 2605/006 (2013.01); C04B 2237/365 (2013.01); C04B 2237/52 (2013.01); C04B 2237/704 (2013.01);
Abstract
Described herein are a bonded ceramic and a manufacturing method therefor. The bonded ceramic includes: a first ceramic substrate; and a second ceramic substrate, wherein the first ceramic substrate and the second ceramic substrate are bonded to each other without an adhesive layer therebetween and include pores, each of which is formed along a bonded surface therebetween and has a size of 0.01 to 50 μm.