The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Sep. 20, 2019
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Sebastian Schuler-Watkins, Herrenberg, DE;

Daniel Haug, Neuffen, DE;

Tobias Henn, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); B81C 3/001 (2013.01); G01L 19/0069 (2013.01); B81B 2201/0264 (2013.01); B81C 2203/037 (2013.01);
Abstract

A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.


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