The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Sep. 20, 2017
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Si-lam Choy, Corvallis, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Michael W Cumbie, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/175 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14145 (2013.01); B41J 2/14201 (2013.01); B41J 2/175 (2013.01); B41J 2002/14419 (2013.01);
Abstract
A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.