The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Sep. 12, 2019
Applicant:

Florida A&m University, Tallahassee, FL (US);

Inventors:

Tarik J. Dickens, Tallahassee, FL (US);

Phong Tran, Tallahassee, FL (US);

Assignee:

Florida A&M University, Tallahassee, FL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/314 (2017.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B29B 11/06 (2006.01); B29C 64/118 (2017.01); B29K 105/16 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 64/314 (2017.08); B29B 11/06 (2013.01); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 70/00 (2014.12); B29K 2101/12 (2013.01); B29K 2105/162 (2013.01);
Abstract

Methods of forming multimaterial fibers via a thermal drawing process used to produce fibers with controlled compositions and alignments. The multimaterial fibers are usable as feedstock for additive manufacturing printing, as well as other applications that require elongated fibers with improved physical characteristics. The multimaterial fibers are formed from a mixture of low dimensional materials (LDM's), such as metal nanoparticles, and thermoplastic matrices. During fabrication of the fibers, a composite of LDM's and thermoplastics is heated and experiences a pulling force on one end in a direction away from an opposing end, thereby drawing the composite into an elongated fiber. The fiber includes a set of physical properties determined by the LDM's, and is usable as a filament across various applications.


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