The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Dec. 03, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Koji Funaoka, Tokyo, JP;
Masayuki Saiki, Tokyo, JP;
Takayuki Hirano, Tokyo, JP;
Hiroaki Ashizawa, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/14 (2014.01); B23K 26/16 (2006.01); B23K 101/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/03 (2013.01); B23K 26/08 (2013.01); B23K 26/1464 (2013.01); B23K 26/16 (2013.01); B23K 2101/18 (2018.08);
Abstract
A laser machining apparatus that separates a workpiece into a machined product and a remnant material by cutting using irradiation with a laser beam includes: a nozzle that squirts gas at a machining point; a rotation mechanism that causes the nozzle or the workpiece to rotate about an optical axis; and a controller that performs control of the rotation mechanism. This control causes the nozzle, which squirts the gas at the machining point, to be at the machined product side during the cutting.