The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Apr. 20, 2020
Applicant:

Stamford Devices Limited, Dangan, IE;

Inventor:

Hong Xu, San Carlos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61M 11/00 (2006.01); B41J 2/16 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); C25D 1/00 (2006.01); C25D 5/00 (2006.01); B05B 17/00 (2006.01); C25D 7/00 (2006.01); C25D 3/38 (2006.01); C25D 3/46 (2006.01); C25D 3/48 (2006.01); C25D 3/54 (2006.01); C25D 5/34 (2006.01); C25D 5/48 (2006.01); C25D 5/54 (2006.01);
U.S. Cl.
CPC ...
A61M 11/005 (2013.01); B05B 17/0646 (2013.01); B41J 2/162 (2013.01); B41J 2/1625 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); C25D 1/003 (2013.01); C25D 3/38 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 3/54 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 5/34 (2013.01); C25D 5/48 (2013.01); C25D 5/54 (2013.01); C25D 5/611 (2020.08); C25D 7/00 (2013.01);
Abstract

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.


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