The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jan. 30, 2017
Applicant:

Fuji Corporation, Chiryu, JP;

Inventors:

Hidetoshi Kawai, Anjo, JP;

Jun Iisaka, Nissin, JP;

Hidetoshi Ito, Okazaki, JP;

Assignee:

FUJI CORPORATION, Chiryu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0408 (2013.01); H05K 13/0411 (2018.08); H05K 13/0417 (2013.01); H05K 13/0812 (2018.08); Y10T 29/53174 (2015.01); Y10T 29/53191 (2015.01);
Abstract

A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.


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