The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Aug. 14, 2020
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Inventors:
Feng Zhou, Ann Arbor, MI (US);
Shohei Nagai, Aichi, JP;
Assignees:
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US);
TOYOTA JIDOSHA KABUSHIKI KAISHA, Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H05K 1/0203 (2013.01); H05K 1/185 (2013.01); H05K 7/20927 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01);
Abstract
A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.