The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Jan. 24, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Takuo Kisaki, Satsumasendai, JP;
Keisuke Sawada, Satsumasendai, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 1/183 (2013.01); H05K 5/0247 (2013.01); H05K 2201/049 (2013.01); H05K 2201/099 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10068 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10378 (2013.01);
Abstract
A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.