The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Apr. 03, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jaeyoung Huh, Suwon-si, KR;

Kyungwan Park, Suwon-si, KR;

Seunghoon Kang, Suwon-si, KR;

Boram Kim, Suwon-si, KR;

Youngjin Kim, Suwon-si, KR;

Sunghoon Moon, Suwon-si, KR;

Hongki Moon, Suwon-si, KR;

Yoonsun Park, Suwon-si, KR;

Hajoong Yun, Suwon-si, KR;

Jonghoon Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); H04N 5/225 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0264 (2013.01); H04N 5/2257 (2013.01); H05K 1/189 (2013.01); H05K 7/2039 (2013.01);
Abstract

An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.


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