The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Oct. 01, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Bichoy Bahr, Allen, TX (US);
Benjamin Stassen Cook, Los Gatos, CA (US);
Scott Robert Summerfelt, Garland, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 11/00 (2006.01); H01L 29/51 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
H04B 11/00 (2013.01); H01L 29/516 (2013.01); G01N 29/2406 (2013.01);
Abstract
In described examples of a CMOS IC, an ultrasonic transducer having terminals is formed on a substrate of the IC. CMOS circuitry having ultrasonic signal terminals is formed on the substrate. At least one metal interconnect layer overlies the ultrasonic transducer and the CMOS circuitry. The at least one metal interconnect layer connects the CMOS circuitry ultrasonic signal terminals to the terminals of the ultrasonic transducer.