The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Dec. 19, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Syuichi Onodera, Kyoto, JP;

Takashi Watanabe, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/72 (2006.01); H01L 23/66 (2006.01); H05K 1/11 (2006.01); H01L 41/053 (2006.01); H03H 9/25 (2006.01); H05K 1/02 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/72 (2013.01); H01L 23/66 (2013.01); H01L 41/053 (2013.01); H03H 9/0547 (2013.01); H03H 9/25 (2013.01); H05K 1/0237 (2013.01); H05K 1/11 (2013.01);
Abstract

A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surfacefacing the mounting surface, an upper surface facing the lower surfaceback to back, and a connection terminalprovided on the lower surface, the upper stage component includes a lower surfacefacing the upper surface, and a connection terminalprovided on the lower surface, and the wiring is provided on the upper surface, and is connected with the connection terminal


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