The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

May. 13, 2021
Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventors:

Michael T. DeRoy, Melbourne, FL (US);

Andres M. Gonzalez, Melbourne, FL (US);

Phill Nickel, Palm Bay, FL (US);

Scott Nelson, Palm Bay, FL (US);

Bill Marquart, Melbourne, FL (US);

Assignee:

EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H01R 43/02 (2006.01); H05K 1/11 (2006.01); H01R 12/58 (2011.01); H05K 1/02 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 43/0256 (2013.01); H01R 12/58 (2013.01); H01R 43/0235 (2013.01); H05K 1/0228 (2013.01); H05K 1/115 (2013.01); H05K 3/1216 (2013.01); H01R 12/737 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09509 (2013.01);
Abstract

Systems and methods for providing a soldered interface between a circuit board and a connector pin. The methods comprise: using a jet paste dispenser to apply first solder into a plated contact cavity formed in the circuit board; using a stencil screen printer to apply second solder (a) over the plated contact cavity which was at least partially filled with the first solder by the jet paste dispenser and (b) over at least a portion of a pad surrounding the plated contact cavity; inserting the connector pin in the plated contact cavity such that the connector pin passes through the second solder and extends at least partially through the first solder; and performing a reflow process to heat the first and second solder so as to create a solder joint between the circuit board and the connector pin.


Find Patent Forward Citations

Loading…