The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Apr. 14, 2021
Applicant:

Semikron Elektronik Gmbh & Co. KG, Nuremberg, DE;

Inventors:

Ingo Bogen, Nuremberg, DE;

Alexander Wehner, Nuremberg, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/426 (2006.01); H01R 12/58 (2011.01); H01R 13/415 (2006.01);
U.S. Cl.
CPC ...
H01R 13/426 (2013.01); H01R 12/585 (2013.01); H01R 13/415 (2013.01);
Abstract

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.


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