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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11387400 B1

PDFFull Text
Date of Patent:
Jul. 12, 2022

Filed:

Jul. 13, 2018

Electronic module with sealing resin

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Junpei Yasuda, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Matthew C Landau

Assistant Examiner:

Mark Hatzilambrou

Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 41/047 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H01L 25/16 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 41/25 (2013.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 41/0475 (2013.01); H01L 41/0477 (2013.01); H01L 41/25 (2013.01); H03H 9/0542 (2013.01); H03H 9/0552 (2013.01); H03H 9/1071 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/49811 (2013.01); H01L 25/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/8085 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An electronic module includes a substrate that includes a first main surface and a second main surface, at least one first electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes a hollow portion, at least one second electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes no hollow portion, and a sealing resin. The at least one first electronic component is mounted on the first main surface of the substrate and sealed with the sealing resin. The at least one second electronic component is mounted on the second main surface of the substrate and is not sealed with the sealing resin.

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