The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Nov. 02, 2020
Applicant:

Corning Research & Development Corporation, Corning, NY (US);

Inventors:

Douglas Llewellyn Butler, Painted Post, NY (US);

James Scott Sutherland, Painted Post, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 21/50 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0232 (2013.01); H01L 21/50 (2013.01); H01L 31/0224 (2013.01); H01L 31/18 (2013.01); H01L 2021/60135 (2013.01);
Abstract

A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.


Find Patent Forward Citations

Loading…