The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Nov. 05, 2020
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Yadong Bai, Dongguan, CN;

Zhijun Qu, Dongguan, CN;

Changxing Sun, Nanjing, CN;

Haitao Han, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H01L 2224/1413 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14156 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/16235 (2013.01); H01R 12/714 (2013.01); H05K 1/185 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10545 (2013.01);
Abstract

This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.


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