The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Dec. 22, 2020
Applicant:
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Inventor:
Sebastien Petitdidier, La Terrasse, FR;
Assignee:
STMICROELECTRONICS (CROLLES 2) SAS, Crolles, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); G06F 21/87 (2013.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); G06F 21/87 (2013.01); H01L 23/481 (2013.01); H01L 23/5222 (2013.01); H01L 23/576 (2013.01);
Abstract
An electronic chip includes a substrate made of semiconductor material. Conductive pads are located on a front side of the substrate and cavities extend into the substrate from a backside of the substrate. Each cavity reaches an associated conductive pad. Protrusions are disposed on the backside of the substrate. A conductive layer covers the walls and bottoms of the cavities. The conductive layer includes portions on the backside, each portion partially located on an associated protrusion and electrically connecting two of the conductive pads.